1、 IEC 61189-3-719 Edition 1.0 2016-01 INTERNATIONAL STANDARD NORME INTERNATIONALE Test methods for electrical materials,printed boards and other interconnection structures and assemblies Part 3-719:Test methods for interconnection structures(printed boards)Monitoring of single plated-through hole(PTH
2、)resistance change during temperature cycling Mthodes dessai pour les matriaux lectriques,les cartes imprimes et autres structures dinterconnexion et ensembles Partie 3-719:Mthodes dessai pour les structures dinterconnexion(cartes imprimes)Contrles de la variation de rsistance des trous mtalliss uni
3、ques(PTH)au cours des cycles de tempratures IEC 61189-3-719:2016-01(en-fr)THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2016 IEC,Geneva,Switzerland All rights reserved.Unless otherwise specified,no part of this publication may be reproduced or utilized in any form or by any means,electronic or m
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